On December 30, 2022, Unified Patents filed an ex parte reexamination proceeding against U.S. Patent 7,007,259, owned and asserted by Bell Semiconductor LLC, an NPE and entity of Hilco Global. The ‘259 patent generally relates to methods for patterning dummy metal to achieve planarity for chemical-mechanical polishing (CMP) of integrated circuits. The patent has been asserted in over 25 litigations against semiconductor companies like NXP, AMD, Micron, Qualcomm, Infineon, Western Digital, Lattice Semiconductor, and others.

View district court litigations by Bell Semiconductor. Unified was represented by Raghav Bajaj, David McCombs, Jon Bowser, and Hong Shi of Hayes Boone, and by in-house counsel Roshan Mansinghani and Michelle Aspen.

To view any documents for the reexamination proceedings on Unified's Portal, go to https://portal.unifiedpatents.com/exparte/90015183.